See maximum funding amount and funding details below
Applications closed on May 2, 2019
Approximate Offer Date:
Sunday, March 31, 2019
The Stanford School of Engineering offers Global Engineering Programs that are designed to enhance engineering education by providing undergraduate and graduate students with opportunities to have an immersive experience in a culturally diverse and international environment. We do this, in part, because we understand that engineers are expected to work globally and we want to prepare our students appropriately.
The Global Engineering Internship (GEI) Program (previously known as CIP and SETII) provides students with an opportunity to learn about developing economy's rapidly expanding role in global business and technology and to gain real-world work experience in a culturally diverse environment. More than 100 host companies have partnered with us in a dozen cities in China, India and Thailand such as Beijing, Shanghai, Shenzhen, Bangalore, Pune and Bangkok. The hosting organizations range from multinational to local companies, from giant corporations to small start-ups. In an effort to serve as many Stanford students as possible, we strive to cover a wide range of engineering fields including Aeronautics and Astronautics, Bioengineering, Chemical Engineering, Civil and Environmental Engineering, Computer Science, Electrical Engineering, Management Science and Engineering, Materials Science and Engineering, Mechanical Engineering, and Product Design. Both undergraduate and graduate students are eligible for this program.
These are intended to be paid internships. The host company would provide stipend so that students can live comfortably, and travel a small amount (on weekends). In some cases, companies provide housing as part of the package. Either the host organization or Stanford GEI program will cover international airfare.
Some example projects (among 100+ potential positions):
1. Human-Computer Interaction (HCI) Intern at Lenovo, Beijing, China
2. User Experience Design at Lenovo, Beijing, China
3. Embedded Hardware Engineer Intern for Augmented Reality Systems, Senscape Technologies Inc., Beijing, China
4. Product Design for blind-aid robots at CloudMinds, Beijing, China
5. Wind Turbine Design at GoldWind, Beijing, China
6. Wind Farm Management and Green Energy Integration at GoldWind, Beijing, China
7. QT Process Review Intern at CH-Auto Technology Corp, Beijing, China
8. Software Engineer Intern at Huawei, Shenzhen, China
9. Cancer Biomarker Screening Project at ABMart, Shanghai, China
10. Product Analysis Intern in MioTek, a SU alum-funded Fintech Start-up, Shanghai, China
11. Front-end Engineer Intern at Alibaba, Hangzhou, China
12. Multicrystalline Silicon Growth at Trina Solar, Changzhou, China
13. Sensor Fusion Platform for Autonomous Vehicles at KPIT, Pune, India
14. Cursive Writing Recognition with Artificial Intelligence at Infosys, Bangalore, India. For more Infosys projects, please see: https://www.infosys.com/instep/internship/projects/Pages/index.aspx
Note that the application deadline is Jan 31st, 2019. Earlier submission will be reviewed sooner. Rolling application/ admission may be offered after the deadline if there are spots (funding) left.
Eligibility and Requirements:
Stanford undergraduate students in good academic standing are eligible to apply.
School of Engineering graduate students are eligible to apply.
Students are required to have completed at least two engineering fundamentals-approved courses (excluding ENGR 70A and CS 106A) prior to departure or have a significant educational background in engineering. See the Undergraduate Engineering Handbook for more details and information on engineering fundamental courses.
Priority will be given to students declared within the School of Engineering who have not previously participated in a GEP program.